3M™ XYZ-Axis Electrically Conductive Tape 9712 , 1 in x 3 yd

Be the first to review this product

1 / RL

Lead Time

12 Day(s)

SKU

3M7100305216-RL

MFRPN

7100305216

3M™ Electrically Conductive Adhesive Transfer Tape 9712 is an XYZ-axis electrically conductive pressure sensitive adhesive (CPSA) tape that helps enable devices to meet electromagnetic compatibility requirements. This double-sided tape has a conductive carbon fiber scrim carrier. It offers a good balance of adhesion and conductivity, which is optimal for larger contact areas where high electrical conductivity is not required. This tape can be die cut and provides excellent workability, easy handling and has nonmetallic product construction for specialty applications. It provides robust protection against EMI in a range of market segments, including consumer electronics, automotive, medical equipment, communications infrastructure, and aerospace and defense electronics.

Skip to the end of the images gallery

Skip to the beginning of the images gallery

Details

3M™ Electrically Conductive Adhesive Transfer Tape 9712 has a good balance of adhesion and conductivity, which is optimal for larger contact areas where high electrical conductivity is not required. This tape provides excellent workability and easy handling. This tape has non-metallic product construction for specialty applications. It provides robust protection against EMI in a range of market segments such as consumer electronics, automotive, medical devices, communication infrastructure, and aerospace & defense electronics.

Recommended Applications:
PCB/flex/chassis grounding
Bond line gap shielding
Electrostatic discharge (ESD)
EMI shield & gasket attachment

From simple to complex designs, our family of shielding and grounding solutions provides protection against EMI. Our solutions provide excellent adhesion to a variety of substrates including metals and plastics. These tapes are easy to apply using low pressure without heat, enhancing productivity. We have multiple thicknesses available to meet even the most space constrained and complex design requirements.

More Information